1. Substrate Preparation: Select a high-quality FR4 PCB substrate as the substrate.
2. Surface Treatment: Cutting, drilling, chemical polishing, etc.
3. Adhesive Printing: Print the adhesive layer onto the PCB surface using silkscreen or screen printing.
4. Insertion: Insert the electronic components onto the adhesive layer according to the SMD pattern.
5. Curing: Use a UV lamp to secure the adhesive layer and electronic components to the PCB surface.
6. Surface Coating: Use a spray coating machine to apply an anti-oxidation layer to the PCB surface to prevent oxidation and corrosion.
